Quality Procedures

It is essential that an electronic component passes the testing stage if it is to be used in production. This is the most significant concern which our clients have. For this reason, it is very important to us that we provide devices of original brand and of the highest quality.

Our quality system ensures that technical errors can be found and determines whether it meets our quality compliance. This reduces a customer’s risk of bringing a new product to market.

We can perform various tests and inspections on a verity of electronic components when necessary. Our quality team may request specific tests to be completed for a particular component. There are many reasons for this. More commonly, a request is made when Excess Stock is available without correct packaging. This is in line with our quality system and allows us to be confident when offering guarantees and also to evaluate our vendors. We often perform spot checks with vendors to ensure they consistently provide excellent quality product.


Electronic Component Testing

All processes are performed by a Components Test Laboratory which is certified as ISO 9001:2008 and also certified as a AS9100-C complaint organisation.

Visual and Electrical tests are preformed free of cost to all customers, if required.

We can meet your testing needs for most types of electronic components and can simulate a test environment based on your needs. Below is a list of common tests which we often undertake if necessary. Other device specific tests can be provided upon request.



Visual Inspection

This inspection verifies the characteristics of parts in order to evaluate quality and originality. This includes inceptions such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.

Common things generally looked for during a visual inspection test of an Integrated Circuit device include:

  • Package Condition and Dimension Check
  • Device Markings and Signs of Remarking
  • Body Inspection to Identify Scratches, Cracks, Corrosion, Contamination, Markings, Coatings, etc.
  • Pin Indicator Orientation, Texture, Coating, Dimensions
  • Lead Condition (Oxidation, Alignment, Exposure, Corrosion, etc.)
  • BGA Inspection for Broken, Damaged or Displaced BGA’s
  • Substrate Condition

AC/DC Electrical Testing

Electronic Tests will verify electrical operating conditions of active and passive components on various types of components from DC limited function to full DC/AC function. We can simulate test conditions depending on industry compliance requirements (i.e., Military, Automotive, Medical, etc.).

Electrical testing is helpful to;

  • evaluate input and output characteristics of components
  • compare known “good” devices with unknown devices to provide some a level of examination
  • detect failure analysis

Solder Testing

The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. It determine if the components will have soldering issue at the contract manufacturer.

Decapsulation Testing

Decapsulation tests can be provided for customers to ensure that the device is produced by the original manufacturer. This destructive test will expose the die, and characteristics such as die markings, metalization damage due to ESD or corrosion will be verified. Decapsulation is usually performed on 1 sample per lot / date code base on MIL-STD-883, Method 2014.

A decapsulation test exposes the internal structure of the device by removing the exterior of the device. This is often achieved using an acid mixture to expose the bonding wires, internal structure, and the die.

X-Ray Inspection

X-ray inspections are non-destructive tests to verify the bond wire connections, die size comparison and ESD damaged. X-Ray are performed base on AS5553 and MIL-STD-883 2012.7. Counterfeit devices can be determined by comparing the structure of the die to a known good device, while the test also analyses:

  • Broken or Missing Bond Wires
  • Wire Bonding Options
  • Void Analysis
  • Check for De-lamination
  • Structure Analysis
  • Die Size Comparison

Incoming Inspection

Performing check for box damaged, ESD protection, type of package, humidity indicator card (HIC) pass H2O test, etc.