X-Ray Inspection

X-ray inspections are non-destructive tests to verify the bond wire connections, die size comparison and ESD damaged. X-Ray are performed base on AS5553 and MIL-STD-883 2012.7. Counterfeit devices can be determined by comparing the structure of the die to a known good device, while the test also analyses:

  • Broken or Missing Bond Wires
  • Wire Bonding Options
  • Void Analysis
  • Check for De-lamination
  • Structure Analysis
  • Die Size Comparison